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Home ProductsSolder Paste Inspection Machine

S8080 SMT 3D SPI Equipment Full Light Spectrum Detect Ability For Opaque Objects Testing

S8080 SMT 3D SPI Equipment Full Light Spectrum Detect Ability For Opaque Objects Testing

    • S8080 SMT 3D SPI Equipment Full Light Spectrum Detect Ability For Opaque Objects Testing
    • S8080 SMT 3D SPI Equipment Full Light Spectrum Detect Ability For Opaque Objects Testing
  • S8080 SMT 3D SPI Equipment Full Light Spectrum Detect Ability For Opaque Objects Testing

    Product Details:

    Place of Origin: CHINA
    Brand Name: SINIC
    Certification: CE
    Model Number: S8080

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 unit
    Price: Negotiation
    Packaging Details: M:1000x900x1525mm;730KG L :1000x950x1525mm;780KG
    Delivery Time: 20 work days
    Payment Terms: Western Union, MoneyGram, L/C, D/A, D/P, T/T
    Supply Ability: 10 unit /month
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    Detailed Product Description

    S8080 Series 

    1. The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.

     

    2. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.

     

    3. By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.

     

    4. Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.

     

    5. Gerber data conversion and import, achieve automatic detection of the entire board. Manual “teach” function realize user-friendly programming and test job generation in case of no Gerber data situation.

     

    6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.

     

    7. Friendly and simple user interface, five minutes of programming and one key operation.

     

    8. Powerful “statistical process control(SPC)”, Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.

     

    9. The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.

     

    Model S8080
    Measurement Principle 3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly
    known as moire fringe technology)
    Measurements Volume,acreage,height, XY offset, shape
    Detected Defects Missing print,insufficient tin, excessive tin, bridging, offset,shapes defects, surface contamination
    Camera Pixel 4M
    Lens Types Telephoto lens
    Lens Resolution 18um(15um as option)
    FOV Size 36*36mm
    Accuracy XY Resolution):1um;Height:0.37um
    Repeatability Height:≤1um (3 Sigma);volume/acreage:<1%(3 Sigma)
    Gage R&R <10%
    FOV Speed 0.45s/FOV
    Red Green Blue/RGB Three Colas
    Option Light Source
    Standard configuration
    Mark-point Detection Time 0.5 sec/piece
    Compensation Plate Bending
    of Real-time Lift in Z-axis
    Standard configuration
    Max. Measuring Height ±350um
    Max. Measuring Height
    of PCB Warp
    ±3.5mm
    Minimum Pad Spacing 200um ( pad height of 150um as the reference)
    Smallest Measuring Size Rectangle:200um;Round:250um
    Maximum PCB Size L460xW460mm,L500mm as option
    PCB Thickness 0.4-5mm
    Top and Bottom Clearance Top 30mm,Bottom 40mm
    Board Edge Clearance 3mm , (multifunctional clip edge as option)
    Flexible or Fixed Orbit Setting Front orbit (back orbit as option)
    PCB Transfer Direction Left to right or right to left
    Orbit Width Adjustment Manual, automatic as option
    SPC Statistics Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repeatability Data; SPI Daily/Weekly/Monthly Reports
    Gerber & CAD Data Import Support Gerber format(274x,274d);Manual Teach model ;CAD X/Y,Part No.,Package Type import
    Computer type HP computer
    CPU Intel 4-core
    RAM 24G
    GPU 1G discrete graphics
    Hard disk 1T
    DVD+RW Standard configuration
    Operating System Windows 7 Professional ( 64 bit)
    Equipment Dimension
    and Weight
    1000x1000x1525mm;815KG
    Power 220V,10A
    Air Pressure 4~6Bar
    Power (Start / normal) Start:2.5kw / Normal operation:2kw
    Loading Requirements
    of the Floor
    600kg/m²
    Options Multifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, printer closed-loop control, offline programming software, rework station, dynamic Mark point read function, coaxial Mark point camera ,
    UPS continuous power supply.

    Contact Details
    Morel Equipments Co.,Ltd

    Contact Person: sales

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